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Volumn 46, Issue 7, 2006, Pages 1183-1188

Optimizing the controller IC for micro HDD process based on Taguchi methods

Author keywords

[No Author keywords available]

Indexed keywords

ASSEMBLY; CONTROL EQUIPMENT; FLASH MEMORY; HARD DISK STORAGE; MATHEMATICAL MODELS; MICROPROCESSOR CHIPS;

EID: 33646478259     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2005.09.008     Document Type: Article
Times cited : (9)

References (8)
  • 1
    • 33646485184 scopus 로고    scopus 로고
    • Coughlin TM, Hanlon P, Waid D. Looking for storage in all the small places; 2004 Entertainment and digital media storage report. Available from .
  • 2
    • 0032180001 scopus 로고    scopus 로고
    • Making room for more performance with chip scale packages
    • Baliga J. Making room for more performance with chip scale packages. Semicond Int October (1998) 85-92
    • (1998) Semicond Int , vol.October , pp. 85-92
    • Baliga, J.1
  • 3
    • 0036890937 scopus 로고    scopus 로고
    • Reliability studies and design improvement of mirror image CSP assembly
    • Xie D., and Yi S. Reliability studies and design improvement of mirror image CSP assembly. Microelectron Reliab 42 (2002) 1931-1937
    • (2002) Microelectron Reliab , vol.42 , pp. 1931-1937
    • Xie, D.1    Yi, S.2
  • 4
    • 33646471626 scopus 로고    scopus 로고
    • IPC Standard. IPC-6012A. p. 8.
  • 5
    • 0029407717 scopus 로고
    • Application of the Taguchi method on the robust design of model 225 plastic ball grid array packages
    • Mertol A. Application of the Taguchi method on the robust design of model 225 plastic ball grid array packages. IEEE Trans Comp Package Manufact Technol B 18 November (1995) 734-743
    • (1995) IEEE Trans Comp Package Manufact Technol B , vol.18 , Issue.November , pp. 734-743
    • Mertol, A.1
  • 6
    • 0031272782 scopus 로고    scopus 로고
    • Optimization of high pin count cavity-up enhanced plastic ball grid array (EPBGA) packages for robust design
    • Mertol A. Optimization of high pin count cavity-up enhanced plastic ball grid array (EPBGA) packages for robust design. IEEE Trans Comp Package Manufact Technol B 20 November (1997) 376-388
    • (1997) IEEE Trans Comp Package Manufact Technol B , vol.20 , Issue.November , pp. 376-388
    • Mertol, A.1
  • 7
    • 0033716845 scopus 로고    scopus 로고
    • Application of the Taguchi method to chip scale package (CSP) design
    • Mertol A. Application of the Taguchi method to chip scale package (CSP) design. IEEE Trans Adv Packag 23 2 (2000) 266-276
    • (2000) IEEE Trans Adv Packag , vol.23 , Issue.2 , pp. 266-276
    • Mertol, A.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.