Effect of filler behavior on nanocomposite SU8 photoresist for moving micro-parts

Microelectronic Engineering

Volumn 83, Issue 4-9 SPEC. ISS., 2006, Pages 1273-1276

  Jiguet, S ^a   Judelewicz, M ^a   Mischler, S ^b   Bertch, A ^b   Renaud, P ^b  

^a Gersteltec Sarl   (Switzerland)

^b EPFL   (Switzerland)

Author keywords

MEMS; Micro parts; Nanocomposites; Photoresist; Stress; SU8; Wear

Indexed keywords

COATINGS; MULTILAYERS; PHOTORESISTORS; STRESS ANALYSIS; WEAR OF MATERIALS;

MICRO-PARTS; NANOCOMPOSITES; PHOTORESIST; SU8; WEAR;

NANOSTRUCTURED MATERIALS;

EID: 33646068765     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2006.01.068     Document Type: Article

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