Fabrication of a tensile test for polymer micromechanics

Microelectronic Engineering

Volumn 83, Issue 4-9 SPEC. ISS., 2006, Pages 1182-1184

  Lang, Udo ^a   Reichen, Marcel ^a   Dual, Jürg ^a  

^a Institute of Mechanical Systems (IMES)   (Switzerland)

Author keywords

Bosch process; Micromechanics; Polyimide; Tensile test

Indexed keywords

LIGHT EMITTING DIODES; MECHANICAL PROPERTIES; POLYIMIDES; POLYMERS; SUBSTRATES; TENSILE TESTING;

BOSCH PROCESS; ORGANIC LAYERS; ORGANIC LIGHT EMITTING DIODES (OLEDS);

COMPOSITE MICROMECHANICS;

EID: 33646056994     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2006.01.050     Document Type: Article

References (9)

1. Haque M.A., and Saif M.T.A. Exp. Mech. 42 (2001) 123
2. Mazza E., Danuser G., and Dual J. Microsyst. Technol. 2 (1996) 83
3. Madou M. Fundamentals of Microfabrication. first ed. (1997), CRC Press, Boca Raton
4. HD Microsystems Europe GmbH, Pyralin PI 2720 Processing Guidelines, 1998.
5. Elschner A., Bruder F., Heuer H.-W., Jonas F., Karbach A., Kirchmeyer S., Thurm S., and Wehrmann R. Synthetic Met. 111 (2000) 139
6. Ouyang J.Y., Guo T.-F., Yang Y., Higuchi H., Yoshioka M., and Nagatsuka T. Adv. Mater. 14 (2002) 915
7. Sirringhaus H., Kawase T., Friend R.H., Shimoda T., Inbasekaran M., Wu W., and Woo E.P. Science 290 (2000) 2123
8. H.C. Starck GmbH, Coating Guide Baytron P Formulations, 2005.
9. Parashkov R., Becker E., Ginev G., Riedl T., Brandes M., Johannes H.-H., and Kowalsky W. Appl. Phys. Lett. 85 (2004) 5751