Transitioning of direct e-beam write technology from research and development into production flow

Microelectronic Engineering

Volumn 83, Issue 4-9 SPEC. ISS., 2006, Pages 749-753

  Pain, L ^a   Icard, B ^a   Manakli, S ^b   Todeschini, J ^c   Minghetti, B ^b   Wang, V ^d   Henry, D ^b  

^a CEA LETI   (France)

^b STMICROELECTRONICS   (France)

^c NXP SEMICONDUCTORS   (Netherlands)

^d Freescale   (France)

Author keywords

ASIC manufacturing; E beam direct write; Lithography; ML2

Indexed keywords

COSTS; LITHOGRAPHY; MASKS; OPTICAL DEVICES; RESEARCH AND DEVELOPMENT MANAGEMENT; SEMICONDUCTOR DEVICE MANUFACTURE;

ASIC MANUFACTURING; E-BEAM DIRECT WRITE; ML2;

ELECTRON BEAMS;

EID: 33646034911     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2006.01.093     Document Type: Article

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