A practical viscoplastic damage model for lead-free solder

Journal of Electronic Packaging

Volumn 128, Issue 1, 2006, Pages 71-81

  Fossum, A F ^a,b   Vianco, P T ^b   Neilsen, M K ^b   Pierce, D M ^c  

^a ASME   (United States)

^b SANDIA NATIONAL LABORATORIES   (United States)

^c Stanford University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FAILURE (MECHANICAL); MICROSTRUCTURE; RELIABILITY; STRAIN; VISCOELASTICITY;

ISOTROPIC DAMAGE EVOLUTION EQUATION; MODEL PREDICTIONS; THERMOMECHANICAL LOADING; VISCOPLASTIC DAMAGE;

SOLDERING ALLOYS;

EID: 33645968111     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.2160514     Document Type: Article

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