Phase-field model for grain boundary grooving in multi-component thin films

Modelling and Simulation in Materials Science and Engineering

Volumn 14, Issue 3, 2006, Pages 433-443

  Bouville, Mathieu ^a   Hu, Shenyang ^b   Chen, Long Qing ^c   Chi, Dongzhi ^a   Srolovitz, David J ^a,d,e  

^a INSTITUTE OF MATERIALS RESEARCH AND ENGINEERING   (Singapore)

^b LOS ALAMOS NATIONAL LABORATORY   (United States)

^c PENNSYLVANIA STATE UNIVERSITY   (United States)

^d INSTITUTE OF HIGH PERFORMANCE COMPUTING   (Singapore)

^e Princeton University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; INTERFACIAL ENERGY; MATHEMATICAL MODELS; MICROSTRUCTURE; POLYCRYSTALLINE MATERIALS; THIN FILMS;

HEATS OF SEGREGATION; INTERFACE ENERGIES; POLYCRYSTALLINE THIN FILMS;

GRAIN BOUNDARIES;

EID: 33645744496     PISSN: 09650393     EISSN: 1361651X     Source Type: Journal    
DOI: 10.1088/0965-0393/14/3/007     Document Type: Article

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