Electrodeposition of Ni from low-temperature sulfamate electrolytes

Journal of the Electrochemical Society

Volumn 153, Issue 5, 2006, Pages

  Goods, S H ^a   Kelly, J J ^b,d   Talin, A A ^a   Michael, J R ^c   Watson, R M ^a  

^a SANDIA NATIONAL LABORATORIES   (United States)

^b IBM T J WATSON RESEARCH CENTER   (United States)

^c SANDIA NATIONAL LABORATORIES   (United States)

^d ELECTROCHEMICAL SOCIETY

Author keywords

[No Author keywords available]

Indexed keywords

CRYSTALLOGRAPHY; CURRENT DENSITY; ELECTROLYTES; FILTRATION; MICROSTRUCTURE; NICKEL;

COLUMNAR GRAINS; GRAIN MORPHOLOGY; PARTICLE FILTERING; SULFAMATE ELECTROLYTES;

ELECTRODEPOSITION;

EID: 33645724348     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.2181447     Document Type: Article

References (22)

1. D. Baudrand, Met. Finish., 94 (7), 15 (1996).
2. J. L. Marti, Plating, 53 (1), 61 (1966).
3. Y. Tsuru, M. Nomura, and F. R. Foulkes, J. Appl. Electrochem., 30, 231 (2000).
4. Y. Tsuru, M. Nomura, and F. R. Foulkes, J. Appl. Electrochem., 32, 629 (2002).
5. T. E. Buchheit, D. A. LaVan, J. R. Michael, T. R. Christenson, and S. D. Leith, Metall. Mater. Trans. A, 33, 539 (2002).
6. J. L. Marti and G. P. Lanza, Plating, 56 (4), 377 (1969).
7. J. W. Dini and H. R. Johnson, Surf. Technol., 4, 217 (1976).
8. B. E. Jacobson and J. W. Sliwa, Plat. Surf. Finish., 66 (9), 42 (1979).
9. W. H. Safranek, The Properties of Electrodeposited Metals and Alloys, 2nd ed., American Electroplaters and Surface Finishers Society, U.S.A. (1986).
10. J. W. Dini, Electrodeposition: The Materials Science of Coatings and Substrates, Noyes Publications, Norwich (1993).
11. A. Ruzzu and B. Matthis, Microsyst. Technol., 8, 116 (2002).
12. J. W. Dini and H. R. Johnson, Thin Solid Films, 54, 183 (1978).
13. J. I. Goldstein, D. E. Newbury, D. C. Joy, C. E. Lyman, P. Echlin, E. Lifshin, L. C. Sawyer, and J. R. Michael, Scanning Electron Microscopy and X-Ray Microanalysis, p. 558, Kluwer Academic/Plenum Publishing, New York (2003).
14. U. F. Kocks, C. N. Tome, and H. R. Wenk, Texture and Anisotropy, Preferred Orientation in Polycrystals and Their Effect on Materials Properties, Cambridge University Press, New York (1998).
15. http://eps.berkeley.edu/~Wenk/TexturePage/beartex.html
16. K. J. Hemker and H. Last, Mater. Sci. Eng., A, 319-321, 882 (2001).
17. H. S. Cho, K. J. Hemker, K. Lian, J. Goettert, and G. Dirras, Sens. Actuators, A, 103, 59 (2003).
18. H. Fischer, Electrodeposition and Surface Treat., 1, 319 (1973).
19. E. O. Hall, Proc. R. Soc. London, 64, 747 (1951).
20. J. Amblard, I. Epelboin, M. Froment, and G. Maurin, J. Appl. Electrochem., 9, 233 (1979).
21. C. Bergenstof Nielsen, A. Horsewell, and M. J. L. Ostergard, J. Appl. Electrochem., 27, 839 (1997).
22. C. S. Lin, P. C. Hsu, L. Chang, and C. H. Chen, J. Appl. Electrochem., 31, 925 (2001).