Effects of disk design and kinematics of conditioners on process hydrodynamics during copper CMP

Journal of the Electrochemical Society

Volumn 153, Issue 5, 2006, Pages

  Li, Zhonglin ^a,e   Lee, Hyosang ^a   Borucki, Len ^b   Rogers, Chris ^c   Kikuma, Ryozo ^d   Rikita, Naoki ^d   Nagasawa, Kenji ^d   Philipossian, Ara ^a  

^a University of Arizona   (United States)

^b Araca Inc   (United States)

^c Tufts University   (United States)

^d Mitsubishi Microelectronics Corporation   (Japan)

^e ELECTROCHEMICAL SOCIETY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FILM THICKNESS; FLUORESCENT DYES; UV-ENHANCED FLUORESCENCE; WAFER;

CHEMICAL MECHANICAL POLISHING; DISKS (STRUCTURAL COMPONENTS); DYES; FLUORESCENCE; KINEMATICS; OSCILLATIONS;

COPPER;

EID: 33645687170     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.2177067     Document Type: Article

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