CON-TACT® brand planarization and ensemble* CP dielectric coating: Smoothing out the bumps on the road to 90NM technology and beyond

Proceedings - Electrochemical Society

Volumn PV 2005-12, Issue , 2005, Pages 620-629

  Daffron, Mark ^a   Shih, Wu Sheng ^a   Marler, Kacie ^a  

^a NONE   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL MECHANICAL PLANARIZATION (CMP); DEFECT REDUCTION; PLANARIZATION; SHALLOW TRENCH ISOLATION (STI) STRUCTURES;

COSTS; DIELECTRIC DEVICES; ELECTRIC CONTACTS; INTEGRATED CIRCUIT MANUFACTURE; REMOVAL; SEMICONDUCTOR DEVICE MANUFACTURE;

COATINGS;

EID: 33645667356     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

1. Mark Daffron, Wu-Sheng Shih, and Rebecca Rich, "The Use of Modified Processes to Reduce Feature Density Effects Observed During Contact Planarization Processes," CMP-MIC Proceedings 2004, 377-383, Marina Del Rey, CA, February 24-26, 2004.
2. Paul A. Farrar, "Low Dielectric Constant Shallow Trench Isolation," U.S. Patent Application No. 20030197234, October 23, 2003.
3. Vu Ho, Don Scansen, and Ed Keyes, "The 1 Billion Transistor Processor: Who Will Be First?" Semiconductor International, March, 2003.
4. James E. Lamb III, "Research on a Novel Planarization Method as an Alternative to CMP," in SEMI® Technology Symposium (STS): Innovations in Semiconductor Manufacturing (ISM), 171-183, SEMICON® West, San Francisco, CA, July 24, 2002.
5. Keng-Chu Lin and Chih-Ta Wu, "Method for Forming a Shallow Trench Isolation Structure," U.S. Patent Application No. 20030203515, October 30, 2003.
6. Jim Schlueder, "Trench Warfare: CMP and Shallow Trench Isolation," Semiconductor International, October 1999.
7. th International Symposium on Microelectronics, 813-818, IMAPS, Boston, MA, November 18-20, 2003.
8. Wu-Sheng Shih, Charles J. Neef, and Mark Daffron, "A Planarization Process for Multi-Layer Lithography Applications," Proceedings of SPIE: Advances in Resist Technology and Processing XXI, John L. Sturtevant, editor, vol. 5376, 2004, in press.