Study of ashing for low-k dielectrics using the N2/O 2 ferrite-core inductively coupled plasmas

Thin Solid Films

Volumn 506-507, Issue , 2006, Pages 222-224

  Kim, Hyoun Woo ^a   Myung, Ju Hyun ^a   Kim, Nam Ho ^a   Lee, Han Sup ^a   Park, Se Geun ^a   Lee, Jae Gab ^b   Chung, Chin Wook ^c   Park, Wan Jae ^d   Kang, Chang Jin ^d   Yoo, Chung Gon ^e   Ko, Kwang Hyuk ^e   Woo, Je Ho ^e   Choi, Sang Don ^e   Choi, Dae Kyu ^e  

^a Inha University   (South Korea)

^b Kookmin University   (South Korea)

^c Hanyang University   (South Korea)

^d SAMSUNG Electronics   (South Korea)

^e New Power Plasma Co Ltd   (South Korea)

Author keywords

Ferrite core; Low k material; Plasma processing and deposition

Indexed keywords

DIELECTRIC MATERIALS; FERRITE; FOURIER TRANSFORM INFRARED SPECTROSCOPY; NITROGEN; OXYGEN; PHOTORESISTS; PLASMA ETCHING;

ASH DAMAGE; GAS FLOW RATIO; LOW-K MATERIALS;

THIN FILMS;

EID: 33645226656     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2005.08.089     Document Type: Conference Paper

References (12)

1. T.C. Chang, P.T. Liu, Y.J. Mei, Y.S. Mor, T.H. Perng, Y.L. Yang, and S.M. Sze J. Vac. Sci. Technol., B 17 1999 2325
2. P.T. Liu, T.C. Chang, Y.S. Mor, and S.M. Sze Jpn. J. Appl. Phys. 38 1999 3482
3. S.A. Vitale, and H.H. Sawin J. Vac. Sci. Technol., A 20 2002 651
4. Y.H. Kim, H.J. Kim, J.Y. Kim, and Y. Lee J. Korean Phys. Soc. 40 2002 94
5. K. Yonekura, S. Sakamori, K. Goto, M. Matsuura, N. Fujiwara, and M. Yoneda J. Vac. Sci. Technol., B 22 2004 548
6. T. Kropewnicki, M. Dahimene, J. Pender, H. Nguyen, H. Fong, R. Hung, and C. Björkman Proceedings of the 23rd Symposium on Dry Process 2001 235
7. H. Nambu, A. Nishizawa, E. Soda, T. Maruyama, and K. Tokashiki Proceedings of the 24th Symposium on Dry Process 2002 15
8. E.L. Boyd J. Appl. Phys. 39 1968 1304
9. F.G. Hewitt J. Appl. Phys. 40 1969 1464
10. K. Takata, F. Tomiyama, and Y. Shiroishi J. Magn. Magn. Mater. 269 2004 131
11. D.-K. Choi, applied for a U.S. patent (Appl. No. 10-2002-63298).
12. T.C. Chang, Y.S. Mor, P.T. Liu, T.M. Tsai, C.W. Chen, Y.J. Mei, and S.M. Sze Thin Solid Films 398-399 2001 632