Low impedance antenna arrangement of internal linear ICP source for large area FPD processing

Thin Solid Films

Volumn 506-507, Issue , 2006, Pages 460-463

  Jung, S J ^a   Kim, K N ^a   Yeom, G Y ^a  

^a Sungkyunkwan University   (South Korea)

Author keywords

Langmuir; Plasma; Uniformity

Indexed keywords

ELECTRIC IMPEDANCE; ELECTRIC POTENTIAL; PHOTORESISTORS; PLASMA DENSITY; SUBSTRATES;

FPD PROCESSING; INTERNAL LINEAR ANTENNAS; LANGMUIR; UNIFORMITY;

INDUCTIVELY COUPLED PLASMA;

EID: 33645217163     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2005.08.047     Document Type: Conference Paper

References (13)

1. F. Mendoza, B. Sarette, D. McReynolds, B. Richardson, and J. Holland Semicond. Int. 1999 (June) 143
2. C.Y. Chang, and S.M. Sze ULSI Technology 1996 McGraw-Hill New York 329
3. J.L. Crowley Solid State Technol. 35 1992 94
4. M.A. Lieberman, and A.J. Lichtenberg Principles of Plasma Discharges and Materials Processing 1994 John Wiley & Sons Inc. New York
5. P.L.G. Ventzek, T.J. Sommerer, R.J. Hoekstra, and M.J. Kushner Appl. Phys. Lett. 63 1993 605
6. J.H. Keller Plasma Phys. Control. Fusion A 39 1997 437
7. M.H. Khater, and L.J. Overzet J. Vac. Sci. Technol., A, Vac. Surf. Films 19 2001 785
8. J. Yu, D. Shaw, P. Gonzales, and G.J. Collins J. Vac. Sci. Technol., A, Vac. Surf. Films 13 1995 871
9. Hikaru Kokura, Keiji Nakamura, Ivan P. Ghanashev, and Hideo Sugai Jpn. J. Appl. Phys. 38 1999 5262
10. Y. Wu, and M.A. Lieberman Plasma Sources Sci. Technol. 9 2000 210
11. M. Kahoh, K. Suzuki, J. Tonotani, K. Aoki, and M. Yamage Jpn. J. Appl. Phys. 40 2001 5419
12. Y. Setsuhara, T. Shoji, A. Ebe, S. Baba, N. Yamamoto, K. Takahashi, K. Ono, and S. Miyake Surf. Coat. Technol. 174-175 2003 33
13. Y. Wu, and M.A. Lieberman Plasma Sources Sci. Technol. 9 2000 210