Low temperature direct bonding using pressure and temperature

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3184, Issue , 1997, Pages 124-128

  Li, Y Albert ^a   Bower, R W ^a  

^a University of California Davis   (United States)

Author keywords

Low temperature direct bond; Plasma activation

Indexed keywords

ACTIVATION PROCESSES; DIRECT BONDINGS; LOW TEMPERATURE DIRECT BOND; PLASMA ACTIVATION; PLASMA PROCESSES; PLASMA TREATMENTS; POINT SOURCES; PRESSURE AND TEMPERATURES; PROCESS USING;

MICROELECTRONIC PROCESSING; MICROELECTRONICS; PLASMAS; SILICON COMPOUNDS;

PLASMA DIAGNOSTICS;

EID: 33645041568     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.280563     Document Type: Conference Paper

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