NEMI's Lead-Free Alloy

Circuits Assembly

Volumn 15, Issue 4, 2004, Pages 20-25

  Rae, Alan ^a   Handwerker, Carol ^b  

^a Cookson Electronics Inc ^*  (United States)

^b NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EUTECTIC COMPOSITION; NATIONAL ELECTRONICS MANUFACTURING INITIATIVE (NEMI) (CO); PROCESS TOLERANCE;

ADHESIVES; CONSUMER ELECTRONICS; DATABASE SYSTEMS; ELECTRONICS PACKAGING; EUTECTICS; MATHEMATICAL MODELS; MELTING; OPTIMIZATION; OXIDATION; PHASE DIAGRAMS; PLUMBING; POTABLE WATER; SOLDERED JOINTS; SOLIDIFICATION; SOLUBILITY; TOXICITY;

ALLOYS;

EID: 2042536688     PISSN: 10540407     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Review

References (1)

1. K-W Moon, et al, Journal of Electronic Materials 29 (2000), pp 1122-1136.