Diffusion boundary layer studies in an industrial wafer plating cell

Journal of the Electrochemical Society

Volumn 152, Issue 5, 2005, Pages

  Wu, B Q ^a   Liu, Z ^a   Keigler, A ^a   Harreil, J ^a  

^a Nexx Systems   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CATHODES; DIFFUSION; ELECTRODEPOSITION; FLIP CHIP DEVICES; MASS TRANSFER; MORPHOLOGY; PLATING; THICKNESS MEASUREMENT;

ELECTRODE SURFACE; REACTING SPECIES; VOLTAMMETRY; WAFER PLATING;

BOUNDARY LAYERS;

EID: 20344402299     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1874674     Document Type: Article

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