Grain boundary sliding and migration in copper: Vacancy effect

Physical Review B - Condensed Matter and Materials Physics

Volumn 72, Issue 6, 2005, Pages

  Ballo, P ^a   Degmova J ^a   Slugen V ^a  

^a SLOVAK UNIVERSITY OF TECHNOLOGY   (Slovakia)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 33644506491     PISSN: 10980121     EISSN: 1550235X     Source Type: Journal    
DOI: 10.1103/PhysRevB.72.064118     Document Type: Article

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