Grain boundary sliding and migration in copper: The effect of vacancies

Computational Materials Science

Volumn 33, Issue 4, 2005, Pages 491-498

  Ballo, P ^a   Slugen V ^a  

^a SLOVAK UNIVERSITY OF TECHNOLOGY   (Slovakia)

Author keywords

Deformation and plasticity; Grain boundary; Monte Carlo methods; Vacancy migration

Indexed keywords

ANNEALING; COMPUTER SIMULATION; COPPER; CRYSTAL ATOMIC STRUCTURE; DEFORMATION; MICROSCOPIC EXAMINATION; MONTE CARLO METHODS; PLASTICITY; POLYCRYSTALLINE MATERIALS; STRUCTURAL OPTIMIZATION; THERMAL EFFECTS;

DEFORMATION AND PLASTICITY; EMBEDDING ATOM METHOD; GRAIN BOUNDARY SLIDING; VACANCY MIGRATION;

GRAIN BOUNDARIES;

EID: 16444377922     PISSN: 09270256     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.commatsci.2004.09.049     Document Type: Article

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