Metallurgy of high strength Ni-Mn microsystems fabricated by electrodeposition

Scripta Materialia

Volumn 51, Issue 8 SPEC. ISS., 2004, Pages 761-766

  Yang, N Y C ^a   Headley, T J ^a   Kelly, J J ^a   Hruby, J M ^a  

^a SANDIA NATIONAL LABORATORIES   (United States)

Author keywords

Electroplating; Hardness; Nickel alloys; Texture; Twinning

Indexed keywords

ASPECT RATIO; BACKSCATTERING; ELECTROPLATING; HARDNESS; METALLURGY; MOLDING; SCANNING ELECTRON MICROSCOPY; TENSILE STRENGTH; TEXTURES; TRANSMISSION ELECTRON MICROSCOPY; TWINNING;

BACKSCATTERED ELECTRON IMAGING (BEI); GRAIN STRUCTURES; MICROFABRICATION; MICROSYSTEMS;

NICKEL ALLOYS;

EID: 3342991796     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.scriptamat.2003.11.001     Document Type: Article

References (20)

1. Becker E.W., Ehrfeld W., Hagmann P., Maner A., Munchmeyer D. Microelectron. Eng. 4:1986;35.
2. Bacher W., Menz W., Mohr J. IEEE Trans. Ind. Electr. 42:1995;431.
3. Hruby J.M. MRS Bull. 26:2001;337.
4. Malone G.A. Plat. Surf. Finish. 74:1987;50.
5. Stephenson W.B. Plating. 53:1966;183.
6. Ernst D.W., Holt M.L. J. Electrochem. Soc. 105(11):1958;69.
7. Dini JW, Johnson HR, Report 1977, SAND77-8020, Sandia, Livermore, CA, USA.
8. Kelly J.J., Goods S.H., Yang N.Y.C. Electrochem. Solid State Lett. 6:2003;C88.
9. Goods SH, Kelly JJ, Yang NYC. Conference abstract for HARMST2003, Monterey, June 15-17, 2003.
10. Yang NYC, Kelly JJ, Goods SH. Poster Presentation for HARMST2003, Monterey, June 15-17, 2003.
11. Buchheit T.E., et al. Metall. Mater. Trans. A. 33:2002;539.
12. Talin AA, et al. Poster Presentation for HARMST2003, Monterey, June 15-17, 2003.
13. Lin C.S., et al. Mater. Trans. 41:2000;777.
14. Lin C.S., et al. Mater. Trans. 42:2001;316.
15. Reed-Hill R.E., Abbaschian R. Physical metallurgy principles. 1992;PWS-Kent Publishing Co. Boston. p. 556.
16. Chaduhuri D.K., Xie D., Lakshmana A.N. Wear. 209:1997;140.
17. Guy A.G., Hren J.J. Elements of physical metallurgy. 1974;Addison Wesley Publishing Co. Menlo Park. p. 464.
18. Mehdizadeh S., Dukovic J.O., Adricacos P.C., Romankiw L.T., Cheh H.Y. J. Electrochem. Soc. 139(1):1992;78.
19. Nilson R.H., Griffiths S.K. J. Electrochem. Soc. 150(6):2003;C401.
20. Griffiths S.K., Nilson R.H., Ting A., Bradshaw R.W., Bonivert W.D., Hruby J.M. Microsys. Technol. 4:1998;98.