Room temperature creep-fatigue response of selected copper alloys for high heat flux applications

Journal of Nuclear Materials

Volumn 329-333, Issue 1-3 PART A, 2004, Pages 865-869

  Li, Meimei ^a,b   Singh, B N ^c   Stubbins, J F ^a  

^a University of Illinois at Urbana Champaign   (United States)

^b OAK RIDGE NATIONAL LABORATORY   (United States)

^c TECHNICAL UNIVERSITY OF DENMARK   (Denmark)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER ALLOYS; CREEP; FATIGUE OF MATERIALS; HEAT FLUX; PRECIPITATION (CHEMICAL); STRAIN; STRESS RELAXATION; STRESSES;

COMPRESSIVE STRAINS; FATIGUE RESPONSES; ROOM TEMPERATURE (RT);

FUSION REACTORS;

EID: 3342955731     PISSN: 00223115     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jnucmat.2004.04.278     Document Type: Conference Paper

References (11)

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