Fatigue behavior of copper and selected copper alloys for high heat flux applications

Journal of Nuclear Materials

Volumn 233-237, Issue PART 1, 1996, Pages 547-552

  Leedy, K D ^a   Stubbins, J F ^a   Singh, B N ^b   Garner, F A ^c  

^a UNIVERSITY OF ILLINOIS AT URBANA CHAMPAIGN   (United States)

^b TECHNICAL UNIVERSITY OF DENMARK   (Denmark)

^c PACIFIC NORTHWEST NATIONAL LABORATORY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER ALLOYS; FATIGUE OF MATERIALS; FATIGUE TESTING; HEAT FLUX; MICROSTRUCTURE; PERFORMANCE; STRENGTHENING (METAL); THERMAL CYCLING; YIELD STRESS;

FATIGUE PERFORMANCES;

COPPER;

EID: 0030262657     PISSN: 00223115     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0022-3115(96)00243-7     Document Type: Article

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