Management of metallic contamination in advanced IC manufacturing

ECS Transactions

Volumn 1, Issue 3, 2006, Pages 3-10

  Danel, A ^a   Renaud, D ^a   Besson, P ^b   Bigot, C ^c   Grouillet, A ^a   Joly, J P ^a   Claes, M ^d   Bearda, T ^d   Frickinger, J ^e  

^a CEA LETI   (France)

^b STMICROELECTRONICS   (France)

^c SUMCO France   (France)

^d IMEC   (Belgium)

^e FRAUNHOFER INSTITUTE FOR INTEGRATED SYSTEMS AND DEVICE TECHNOLOGY IISB   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

CONTAMINATION; OXIDES; SILICON WAFERS;

CONTAMINATION ANALYSIS CAPABILITIES; METALLIC CONTAMINATION; PRODUCTION EQUIPMENTS;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 32844475339     PISSN: 19385862     EISSN: 19386737     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)

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