A vapor chamber using graphite foams as wicks for cooling high heat flux electronics

Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005

Volumn PART A, Issue , 2005, Pages 233-238

  Lu, Minhua ^a   Mok, Larry ^a   Bezama, R J ^b  

^a IBM T J WATSON RESEARCH CENTER   (United States)

^b IBM MICROELECTRONICS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FOAMS; GRAPHITE; HEAT FLUX; POWER ELECTRONICS; THERMAL CONDUCTIVITY;

GRAPHITE FOAM; HEAT FLUX ELECTRONICS; WICKS;

HEAT PIPES;

EID: 32844459272     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/ipack2005-73170     Document Type: Conference Paper

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