Machined surface and subsurface in relation to cutting edge radius in nanoscale ductile cutting of silicon

Transactions of the North American Manufacturing Research Institute of SME

Volumn 33, Issue , 2005, Pages 113-119

  Arefin, S ^a   Li, X P ^a   Rahman, M ^a   He, T ^a  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

Cutting Edge Radius; Ductile Mode Cutting; Silicon Wafer; Subsurface Damage

Indexed keywords

CRACKS; CUTTING; DUCTILITY; MACHINING; SILICON WAFERS;

CUTTING EDGE RADIUS; DUCTILE MODE CUTTING; SUBSURFACE DAMAGE;

SILICON;

EID: 32844455670     PISSN: 10473025     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (13)

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