Nanometer scale ductile cutting of tungsten carbide

Transactions of the North American Manufacturing Research Institution of SME

Volumn 31, Issue , 2003, Pages 153-160

  Liu, Kui ^a   Li, Xiaoping ^a   Liang, Steven Y ^b  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

^b GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AXIAL FORCES; CHIP FORMATIONS; CHIP THICKNESS; CRITICAL VALUE; CUTTING CONDITIONS; CUTTING EXPERIMENT; CUTTING FORCES; CUTTING PERFORMANCE; CUTTING SPEED; DEPTH OF CUT; DUCTILE CUTTING; DUCTILE MODE CUTTING; DUCTILE-MODE; FEED-RATES; FLANK FACE; FRACTURED SURFACES; NANO-METER SCALE; RADIAL FORCES; SEM OBSERVATION; TANGENTIAL FORCE; THREE-COMPONENT; TOOL CUTTING EDGE; TOOL FLANK WEAR; TOOL WEAR; TOOL WEAR MECHANISM; UNDEFORMED CHIP THICKNESS; WORK PIECES;

ADHESION; DIAMOND CUTTING TOOLS; INDUSTRIAL RESEARCH; MACHINE TOOLS; MANUFACTURE; SURFACE ROUGHNESS; SURFACES; TRIBOLOGY; TUNGSTEN; WEAR OF MATERIALS;

TUNGSTEN CARBIDE;

EID: 10044269155     PISSN: 10473025     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

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