The characterization of damage propagation in BGA's on flip-chip electronic packages

Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005

Volumn PART B, Issue , 2005, Pages 1565-1573

  Helms, Kayleen L E ^a   Phillips, Betty ^a  

^a INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CRACK INITIATION; CRACK PROPAGATION; ELECTRONICS PACKAGING; FAILURE ANALYSIS; RELIABILITY; SOLDERED JOINTS;

INTERNAL HEAT SPREADERS (IHS); SEQUENTIAL LOADING; SURFACE CRACKS;

FLIP CHIP DEVICES;

EID: 32844455270     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/ipack2005-73429     Document Type: Conference Paper

References (7)

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7. K. Donghyum, J. M. D. Filho, C. Park, A. Mawer, T. J. Moon, and G. Y. Masada, "Crack Length Analysis of SbPb and SnAg Solder Joints in Plastic Ball Grid Array Packages from Dye Penetration Studies", Proc. of Elec. Comp. & Tech. Conf. 2003, pp. 1746-1753.