Effect of compression loads on the solder joint reliability of flip chip BGA packages

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2004, Pages 692-698

  Garner, Luke ^a   Zhang, Charles ^a   Beh, Keh Shin ^a   Helms, Kayleen ^a   Tan, Yew Lip ^a  

^a INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FLIP CHIP; SPRING LOAD; THERMAL COMPRESSION; THERMAL CYCLE (TC);

CREEP; FINITE ELEMENT METHOD; INTERFACES (MATERIALS); MICROPROCESSOR CHIPS; RELIABILITY; STIFFNESS; THERMAL EFFECTS;

SOLDERED JOINTS;

EID: 10444273158     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. Eyman, M L, "Investigation of Heat Sink Attach Methodologies and the Effects on Package Structural Integrity and Interconnect Reliability of the 119-Lead Plastic Ball Grid Array" Proc. Elect. Comp. and Tech. Conf. 1997, pp. 1068-1075.
2. J. H. Lau, Thermal Stress and Strain in Mecroelectronics Packaging. New York: Van Nostrand Reinhold, 1993
3. Hong B Z, and Burrell, L G, "Modeling Thermally Induced Viscoplastic Dformation and Low Cycle Fatigue of CBGA Solder Joints in a Surface Mount Package", IEEE Trans, on Comp., Packaging, and Manu. Tech. -Part A, Vol 20. No 3, 1997, pp. 280-285.
4. Darveaux, R, "Effect of Simulation Methodology on Solder Joint Crack Growth Correlation", Proc. Elect. Comp. and Tech. Conf. 1997, pp. 1068-1075.