Plastic separation planning for end-of-life electronics

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 29, Issue 2, 2006, Pages 110-118

  Williams, Julie Ann Stuart ^a   Grant, Edward R ^b   Rios, Pedro ^c,d   Blyler, Leslie ^c,e   Tieman, Lisa ^c,f   Twining, Leslie ^c,g   Bonawi Tan, Winston ^c,h   Madden, Michelle ^c,i   Meyer Guthrie, Nathalie R ^j,k  

^a UNIVERSITY OF WEST FLORIDA   (United States)

^b UNIVERSITY OF BRITISH COLUMBIA   (Canada)

^c SCHOOL OF INDUSTRIAL ENGINEERING   (United States)

^d FLORIDA INTERNATIONAL UNIVERSITY   (United States)

^e INTEL CORPORATION   (United States)

^f ELI LILLY AND COMPANY   (United States)

^g UNIVERSITY OF PITTSBURGH   (United States)

^h Tranzact Technologies   (United States)

ⁱ Raytheon Technical Services Company   (United States)

^j PURDUE UNIVERSITY   (United States)

^k Cairo Corporation   (United States)

more..

Author keywords

Disassembly; Electronics recycling; Plastics; Raman spectroscopy; Work measurement

Indexed keywords

ASSEMBLY; EXTRAPOLATION; PLASTICS APPLICATIONS; RAMAN SPECTROSCOPY; RECYCLING; SERVICE LIFE;

ELECTRONICS RECYCLING; END-OF-LIFE ELECTRONICS; WORK MEASUREMENT;

ELECTRONIC EQUIPMENT MANUFACTURE;

EID: 32144453344     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEPM.2006.874968     Document Type: Article

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