High density LTCC technology, using photo patterned conductors

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4428, Issue , 2001, Pages 358-363

  Ehlert, M ^a   Barnwell, P ^a  

^a NATIONAL SEMICONDUCTOR CORPORATION   (United States)

Author keywords

High density; LTCC; Microwave; Thick film; Wireless

Indexed keywords

CERAMIC MATERIALS; DIGITAL CIRCUITS; ELECTRIC CONDUCTIVITY OF SOLIDS; ELECTRIC CONDUCTORS; MICROWAVE CIRCUITS; MULTILAYERS; PARALLEL PROCESSING SYSTEMS; THICK FILMS;

HIGH DENSITY INTERCONNECT; LOW TEMPERATURE CO-FIRED CERAMIC; PHOTOSENSITIVE SILVER CONDUCTORS;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 0034829576     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. A flexible manufacturing approach for low-temperature co-fired ceramic MCM
2. Advanced ceramic technologies for handsets
3. RF module solutions for wireless applications
4. High density MCM-C utilizing tape dielectric and photopatterning processes