Direction-dependent grain interaction in nickel and copper thin films, analysed by X-ray diffraction

Acta Materialia

Volumn 54, Issue 5, 2006, Pages 1419-1430

  Kumar, A ^a   Welzel, U ^a   Mittemeijer, E J ^a  

^a MAX PLANCK INSTITUTE FOR INTELLIGENT SYSTEMS   (Germany)

Author keywords

Direction dependent grain interaction; Residual stresses; Texture; Thin films; X ray diffraction

Indexed keywords

ANISOTROPY; COPPER; CRYSTAL MICROSTRUCTURE; NICKEL; POLYCRYSTALS; RESIDUAL STRESSES; TEXTURES; THIN FILMS; X RAY DIFFRACTION ANALYSIS;

ELASTIC GRAIN INTERACTION; SURFACE ANISOTROPY;

METALLIC FILMS;

EID: 32044471864     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2005.10.063     Document Type: Article

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