SCOPUS 정보 검색 플랫폼

Journal of Materials Science and Technology

Volumn 21, Issue 6, 2005, Pages 875-878

Preparation and arc breakdown behavior of nanocrystalline W-Cu electrical contact materials

(3) Chen, Wenge a,b Kang, Zhanying b Ding, Bingjun b

a XI'AN UNIVERSITY OF TECHNOLOGY (China)

b XI'AN JIAOTONG UNIVERSITY (China)

Author keywords

Arc; Electrical breakdown; Nanostructured materials; W Cu alloy

Indexed keywords

COPPER ALLOYS; ELECTRIC BREAKDOWN; ELECTRIC CONDUCTIVITY; HARDNESS; HOT PRESSING; MECHANICAL ALLOYING; MICROSTRUCTURE; NANOSTRUCTURED MATERIALS; SINTERING; TUNGSTEN ALLOYS; VACUUM FURNACES;

BREAKDOWN VOLTAGE; ELECTRIC ARC EROSION; ELECTRICAL CONTACT MATERIALS; NANOCRYSTALLINE; PREPARATION;

ELECTRIC CONTACTS;

EID: 31844453887 PISSN: 10050302 EISSN: None Source Type: Journal
DOI: None Document Type: Article

Times cited : (17)

References (14)

1
- 0035513336
- L.J.Kecskes, M.D.Trexler, B.R.Klotz, K.C.Choand and R.J.Dowding: Metall. Mater. Trans. A, 2001, 32(11). 2885.
- (2001) Metall. Mater. Trans. A , vol.32 , Issue.11 , pp. 2885
- Kecskes, L.J.¹ Trexler, M.D.² Klotz, B.R.³ Choand, K.C.⁴ Dowding, R.J.⁵

2
- 31844448424
- B.Thomas, K.V.Walter, M.Roland and K.E.Sacegr: IEEE Trans., 1991, 14(1), 8.
- (1991) IEEE Trans. , vol.14 , Issue.1 , pp. 8
- Thomas, B.¹ Walter, K.V.² Roland, M.³ Sacegr, K.E.⁴

3
- 0029306190
- C.S.Xiong, Y.H.Xiong, H.Zhu, T.F.Sun and J.H.Yu: Nanostruct. Mater., 1995, 5(5), 425.
- (1995) Nanostruct. Mater. , vol.5 , Issue.5 , pp. 425
- Xiong, C.S.¹ Xiong, Y.H.² Zhu, H.³ Sun, T.F.⁴ Yu, J.H.⁵

4
- 0032132047
- J.C.Kim, S.S.Ryu, Y.D.Kim and I.H.Moon: Scripta Mater., 1998, 39(6), 669.
- (1998) Scripta Mater. , vol.39 , Issue.6 , pp. 669
- Kim, J.C.¹ Ryu, S.S.² Kim, Y.D.³ Moon, I.H.⁴

5
- 0033336541
- J.C.Kim, S.S.Ryu and I.H.Moon: J. Adv. Mater., 1999, 31(4), 37.
- (1999) J. Adv. Mater. , vol.31 , Issue.4 , pp. 37
- Kim, J.C.¹ Ryu, S.S.² Moon, I.H.³

6
- 0034749332
- D.Y.Ying and D.L.Zhang: Mater. Sci. Technol., 2001, 17(7), 815.
- (2001) Sci. Technol. , vol.17 , Issue.7 , pp. 815
- Ying, D.Y.¹ Zhang, D.L.²

7
- 0031988462
- J.C.Kim and I.H.Moon: Nanostruct. Mater., 1998, 10(2), 283.
- (1998) Nanostruct. Mater. , vol.10 , Issue.2 , pp. 283
- Kim, J.C.¹ Moon, I.H.²

8
- 0008938014
- J.Kaczmar: Powder Metall., 1989, 32(3), 171.
- (1989) Powder Metall. , vol.32 , Issue.3 , pp. 171
- Kaczmar, J.¹

9
- 0030104264
- B.J.Ding, Z.Yang and X.Wang: IEEE Trans. on CPMT, 1996, 19(1), 76.
- (1996) IEEE Trans. on CPMT , vol.19 , Issue.1 , pp. 76
- Ding, B.J.¹ Yang, Z.² Wang, X.³

10
- 0036960336
- Chinese source
- Wenge CHEN, Bingjun DING and Hui ZHANG: The Chinese J. Nonferrous Metals, 2002, 18(12), 1224. (in Chinese)
- (2002) The Chinese J. Nonferrous Metals , vol.18 , Issue.12 , pp. 1224
- Chen, W.¹ Ding, B.² Zhang, H.³

11
- 0033316494
- H.Zhang, Z.Yang and B.Ding: IEEE Trans. on CPT Part A, 1999, 22(3), 455.
- (1999) IEEE Trans. on CPT Part A , vol.22 , Issue.3 , pp. 455
- Zhang, H.¹ Yang, Z.² Ding, B.³

12
- 0033332275
- Y.Wang and B.J.Ding: IEEE Trans. on CPT Part A, 1999, 22(3), 467.
- (1999) IEEE Trans. on CPT Part A , vol.22 , Issue.3 , pp. 467
- Wang, Y.¹ Ding, B.J.²

13
- 0037463966
- F.Wang, F.Zhuge, H.Zhang and B.Ding: Mater. Res. Bull., 2003, 38, 629.
- (2003) Mater. Res. Bull. , vol.38 , pp. 629
- Wang, F.¹ Zhuge, F.² Zhang, H.³ Ding, B.⁴

14
- 0242573688
- Y.Wang, C.Zhang, H.Zhang, B.Ding and K.Lu: J. Phys. D: Appl. Phys., 2003, 364, 2649.
- (2003) J. Phys. D: Appl. Phys. , vol.364 , pp. 2649
- Wang, Y.¹ Zhang, C.² Zhang, H.³ Ding, B.⁴ Lu, K.⁵

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