Influence of microstructure on dielectric strength of CuCr contact materials in a vacuum

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Volumn 19, Issue 1, 1996, Pages 76-81

  Ding, Bingjun ^a,b   Yang, Zhimao ^b   Wang, Xiaotian ^b  

^a IEEE

^b XI'AN JIAOTONG UNIVERSITY   (China)

Author keywords

Contact; Copper materials; Dielectric breakdown

Indexed keywords

CRYSTAL MICROSTRUCTURE; DIELECTRIC PROPERTIES OF SOLIDS; ELECTRIC BREAKDOWN; ELECTRIC CONTACTS; VACUUM;

DIELECTRIC STRENGTH; MICROCOMPOSITIONS;

COPPER ALLOYS;

EID: 0030104264     PISSN: 10709886     EISSN: None     Source Type: Journal    
DOI: 10.1109/95.486565     Document Type: Article

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