The preparation and the properties of microcrystalline and nanocrystalline CuCr contact materials

IEEE Transactions on Components and Packaging Technologies

Volumn 22, Issue 3, 1999, Pages 467-472

  Wang, Yaping ^a,b   Ding, Bingjun ^a,c  

^a IEEE   (China)

^b INSTITUTE OF METAL RESEARCH   (China)

^c XI'AN JIAOTONG UNIVERSITY   (China)

Author keywords

CuCr contacts; Microcrystalline; Nanocrystalline; Voltage withstand

Indexed keywords

BALL MILLING; BINARY ALLOYS; COPPER ALLOYS; HOT PRESSING; MECHANICAL ALLOYING; MORPHOLOGY; NANOSTRUCTURED MATERIALS;

COPPER CHROMIDE;

ELECTRIC CONTACTS;

EID: 0033332275     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/6144.796552     Document Type: Article

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