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Volumn PV 2004-17, Issue , 2004, Pages 193-204

Uniform copper electroplating on resistive substrates

Author keywords

[No Author keywords available]

Indexed keywords

COPPER ELECTROPLATING; PLANAR TOPOGRAPHY; RESISTIVE SUBSTRATES; SHEET RESISTANCE;

EID: 31744443291     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (2)

References (5)
  • 3
    • 0033262699 scopus 로고    scopus 로고
    • Experimental and analytical study of seed layer resistance for copper damascene electroplating
    • E. K. Broadbent, E.J. McInerney, L.A. Gochberg, and R.L. Jackson, "Experimental and Analytical Study of Seed Layer Resistance for Copper Damascene Electroplating", J. Vac. Sci. Technol. B 17, 2584 (1999)
    • (1999) J. Vac. Sci. Technol. B , vol.17 , pp. 2584
    • Broadbent, E.K.1    McInerney, E.J.2    Gochberg, L.A.3    Jackson, R.L.4
  • 4
    • 31744444192 scopus 로고    scopus 로고
    • U.S. Patent 6,375,823
    • U.S. Patent 6,375,823 (1999)
    • (1999)
  • 5
    • 31744433390 scopus 로고    scopus 로고
    • U.S. Patent 6,632,335
    • U.S. Patent 6,632,335 (2000)
    • (2000)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.