Front-End electronics and integration of ATLAS pixel modules

Nuclear Instruments and Methods in Physics Research, Section A: Accelerators, Spectrometers, Detectors and Associated Equipment

Volumn 549, Issue 1-3, 2005, Pages 157-164

  Hugging F ^a  

^a UNIVERSITY OF BONN   (Germany)

Author keywords

ATLAS; Bump bonding; Deep sub micron; Front End electronics; Hybridization; Pixel; Silicon detector

Indexed keywords

DATA REDUCTION; RADIATION DETECTORS; RADIATION EFFECTS; READOUT SYSTEMS; SILICON SENSORS;

ATLAS; BUMP-BONDING; DEEP SUB-MICRON; FRONT-END ELECTRONICS; HYBRIDIZATION; SILICON DETECTORS;

POWER ELECTRONICS;

EID: 31644436429     PISSN: 01689002     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.nima.2005.04.045     Document Type: Conference Paper

References (5)

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2. R. Beccherle Nucl. Instr. and Meth. A 492 2002 117
3. W. Snoeys Nucl. Instr. and Meth. A 439 2000 349
4. T. Calin, M. Nicolaidis, and R. Velazco IEEE Trans. Nucl. Sci. NS-43 6 1996 2874
5. J. Grosse-Knetter, Nucl. Instr. and Meth., this issue, doi:10.1016/j.nima.2005.04.028.