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Journal of Electronic Materials
Volumn 19, Issue 9, 1990, Pages 919-928
Deformation and bonding processes in aluminum ultrasonic wire wedge bonding
Author keywords

Al; TEM; ultrasonic wire bonding
Indexed keywords

ALUMINUM MAGNESIUM ALLOYS; BONDING--ULTRASONIC APPLICATIONS; MICROSCOPIC EXAMINATION--TRANSMISSION ELECTRON MICROSCOPY; WIRE--ALUMINUM;
EID: 0025493467     PISSN: 03615235     EISSN: 1543186X     Source Type: Journal    
DOI: 10.1007/BF02652917     Document Type: Article
Times cited : (42)
References (10)
  • 2
    • 84936532296 scopus 로고    scopus 로고
    • G. G. Harman and K. O. Leedy, 10th Annu. Proc. of Reliability Phys. Symp., pp. 49–56 (1972).
  • 4
    • 84936532299 scopus 로고    scopus 로고
    • V. H. Winchell, 14th Annu. Proc. Reliability Phys. Symp., pp. 98–107 (1976).
  • 6
    • 84936532298 scopus 로고    scopus 로고
    • H. Kreye, Welding Journal 154s (1975).
  • 7
    • 84936532295 scopus 로고    scopus 로고
    • J. E. Krzanowski, Proc. 39th Electron. Comp. Conf., Houston, TX, p. 451–456 (1989); also to be published in the March issue of the IEEE Trans, on CHMT.

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.