Electrochemical kinetics study of electroless copper plating for electronics application

Materials Science Forum

Volumn 449-452, Issue I, 2004, Pages 393-396

  Kim, Dae Geun ^a   Bae, Jin Soo ^a   Lee, Jae Ho ^a   Kim, Yangdo ^b   Ahn, Yoomin ^c  

^a Hong Ik University   (South Korea)

^b Pusan National University   (South Korea)

^c Hanyang University   (South Korea)

Author keywords

Additive; Electroless copper plating; Mixed potential

Indexed keywords

ADDITIVES; CONTAMINATION; COPPER PLATING; DIFFUSION; ELECTRIC CONDUCTIVITY; ELECTROLYTES; MICROELECTROMECHANICAL DEVICES; OXIDATION; REACTIVE ION ETCHING; REDUCTION; ULSI CIRCUITS;

DIFFUSION BARRIERS; ELECTRODE POTENTIAL; ELECTROLESS COPPER PLATING; MIXED POTENTIAL;

ELECTROCHEMISTRY;

EID: 3142681740     PISSN: 02555476     EISSN: 16629752     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/msf.449-452.393     Document Type: Conference Paper

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