Modeling of substrate remelting, flow, and resolidification in microcasting

Numerical Heat Transfer; Part A: Applications

Volumn 48, Issue 10, 2005, Pages 987-1008

  Hong, F J ^a   Qiu, H H ^a  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

CASTING; HEAT RESISTANCE; SUBSTRATES;

DROPLET SPREADING; SUBSTRATE REMELTING; SUBSTRATE TEMPERATURE;

SOLIDIFICATION;

EID: 30544451029     PISSN: 10407782     EISSN: 15210634     Source Type: Journal    
DOI: 10.1080/10407780500226647     Document Type: Article

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