Electrochemical growth of nickel hollow nanostructures on copper substrates

Journal of Physical Chemistry B

Volumn 109, Issue 49, 2005, Pages 23300-23303

  Li, Gao Ren ^a   Kay, Lin Gang ^b   Liu, Guan Kun ^a   Tong, Ye Xiang ^b  

^a SUN YAT SEN UNIVERSITY   (China)

^b University of Cincinnati   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COERCIVE FORCE; COPPER; ELECTROCHEMISTRY; NANOSTRUCTURED MATERIALS; PARTICLE SIZE ANALYSIS;

DEPOSITION TIME; ELECTROCHEMICAL DEPOSITION; SOLVENT MIXTURES;

NICKEL;

EID: 30544440737     PISSN: 15206106     EISSN: None     Source Type: Journal    
DOI: 10.1021/jp0549879     Document Type: Article

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