Characterization of the chemical effects of ceria slurries for chemical mechanical polishing

Materials Research Society Symposium Proceedings

Volumn 867, Issue , 2005, Pages 69-74

  Abiade, J T ^a,c   Yeruva, S ^a   Moudgil, B ^a   Kumar, D ^c   Singh, R K ^b  

^a University of Florida   (United States)

^b The University of Texas at Austin   (United States)

^c North Carolina Agricultural and Technical State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC FORCE MICROSCOPY; CERIUM COMPOUNDS; CHEMICAL MECHANICAL POLISHING; CHEMICAL VAPOR DEPOSITION; OXIDES; SCANNING ELECTRON MICROSCOPY; SILICA;

CERIA THIN FILMS; FRICTION FORCE; SHALLOW TRENCH ISOLATION (STI);

SLURRIES;

EID: 30544436780     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-867-w8.3     Document Type: Conference Paper

References (9)

1. L. M. Cook, Journal of Non-Cryst. Solids, v120, (1990), 152.
2. T. Hoshino et al., Journal of Non-Cryst. Solids, v283, (2001), p. 129.
3. F. Katsuki et al., Journal of the Electrochemical Society, v147, (6), (2000), 2328.
4. R. Garcia and R. Perez, Surface Science Reports, v47, (2002), p. 197.
5. J. T. Abiade, W. Choi, V. Khosla, and R. K. Singh, in Advances in Chemical-Mechanical Polishing, edited by Duane S. Boning, Johann W. Bartha, Ara Philipossian, Greg Shinn, and Ingrid Vos, Materials Research Society Symposium Proceedings, v816, Warrendale, PA, (2004), K9.5
6. and J.T. Abiade, W. Choi and R.K. Singh, Journal of Materials Research, v20, (5), (2005), 1139.
7. W. Choi, S-M, Lee, and R. K. Singh, Electrochemical and Solid-State Letters, v7, (7), (2004), G141.
8. J. T. Abiade, S. Yeruva, B. Moudgil, D. Kumar, and R.K. Singh, Electrochemical and Solid State Letters, under review.
9. J. T. Abiade, S. Yeruva, D. Kumar, and R.K. Singh, Journal of the Electrochemical Society, in progress.