Power bus signal integrity improvement and EMI mitigation on multilayer high-speed digital PCBs with embedded capacitance

IEEE Transactions on Mobile Computing

Volumn 2, Issue 4, 2003, Pages 314-321

  Ricchiuti, Vittorio ^a  

^a SIEMENS AG   (Germany)

Author keywords

Electric field strength; Embedded capacitance; Power bus; Power supply decoupling; Power ground layers; S parameters

Indexed keywords

CAPACITANCE; ELECTRIC FIELD EFFECTS; ELECTRIC POWER DISTRIBUTION; ELECTROMAGNETIC COMPATIBILITY; FREQUENCIES; MICROPROCESSOR CHIPS; MULTILAYERS; PRINTED CIRCUIT BOARDS; SCATTERING PARAMETERS; SIGNAL INTERFERENCE;

ELECTRIC FIELD STRENGTH; EMBEDDED CAPACITANCE; POWER BUS; POWER SUPPLY DECOUPLING; POWER/GROUND LAYERS;

MOBILE TELECOMMUNICATION SYSTEMS;

EID: 3042805209     PISSN: 15361233     EISSN: None     Source Type: Journal    
DOI: 10.1109/TMC.2003.1255646     Document Type: Article

References (12)

1. International Technology Roadmap for Semiconductors, 1999 ed., San Jose, Calif.: Semiconductor Industry Assoc., Mar. 2000.
2. B.R. Archambeault, PCB Design for Real-World EMI Control. Boston: Kluwer, 2002.
3. X. Ye, D.M. Hockanson, M. Li, Y. Ren, W. Cui, J.L. Drewniak, and R.E. DuBroff, "EMI Mitigation with Multilayer Power-Bus Stacks and via Stitching of Reference Planes," IEEE Trans. Electromagnetic Compatability, vol. 43, no. 4, Nov. 2001.
4. V. Ricchiuti, A. Orlandi, and G. Antonini, "Buried Capacitance Technology for Power Bus Decoupling on High Speed Digital PCB's," Proc. 14th Int'l Zurich Symp. Electromagnetic Compatibility, 2001.
5. V. Ricchiuti, "Power Supply Decoupling on Fully Populated High Speed Digital PCBs," IEEE Trans. EMC, vol. 43, no. 4, Nov. 2001.
6. S. Haga, K. Nakano, and O. Hashimoto, "Reduction in Radiated Emission by Symmetrical Power-Ground Layer Stack-Up PCB with No Open Edge," Proc. IEEE Int'l Symp. EMC, 2002.
7. M. Leone and L. Jung, "Quantification of the Radiation Level of Power-Bus Structures on Printed Circuit Boards," Proc. EMC Europe 2002 Symp., pp. 317-321, Sept. 2002.
8. V. Ricchiuti, A. Orlandi, G. Antonini, and P. Illuminati, "Effects of Power Bus Stitching on Signal Integrity and Thermal Analysis," Proc. 2003 IEEE Int'l Symp. EMC, 2003.
9. D.A. Frickey, "Conversions. Between S, Z, Y, h, ABCD, and T Parameters which are Valid for Complex Source and Load Impedances," IEEE Trans. Microwave Theory Technology, vol. 42, no. 2, pp. 205-211, Feb. 1994.
10. H. Shi, F. Sha, J.L. Drewniak, T.P. Van Doren, and J.H. Hubing, "An Experimental Procedure for Characterizing Interconnects to the DC Power Bus on a Multilayer Printed Circuit Board," IEEE Trans. EMC, vol. 39, pp. 279-285, Nov. 1997.
11. R.F. Harrington, Time-Harmonic Electromagnetic Fields. McGraw-Hill, 1961.
12. Computer Simulation Technology, CST Microwave Studio Manual, vol. I-II, 2003, www.cst.del.