Bubble formation at grain boundaries in helium implanted copper

Scripta Materialia

Volumn 51, Issue 6, 2004, Pages 557-560

  Thorsen, P A ^a,b   Bilde Sorensen J B ^a   Singh, B N ^a  

^a TECHNICAL UNIVERSITY OF DENMARK   (Denmark)

^b Rockwool International AS   (Denmark)

Author keywords

Copper; Grain boundaries; Helium bubbles; Implantation; Misorientation; Transmission electron microscopy

Indexed keywords

ANNEALING; BUBBLES (IN FLUIDS); CRYSTAL ORIENTATION; DIFFUSION; GRAIN BOUNDARIES; HELIUM; ION IMPLANTATION; NUCLEATION; REGRESSION ANALYSIS; TRANSMISSION ELECTRON MICROSCOPY;

DIFFUSIVITY; HELIUM BUBBLES; IMPLANTATION; MISORIENTATION;

COPPER;

EID: 3042802016     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.scriptamat.2004.05.038     Document Type: Article

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