Influence of grain boundary structure on bubble formation behaviour in helium implanted copper

Materials Science Forum

Volumn 207-209, Issue PART 2, 1996, Pages 445-448

  Thorsen, P A ^a   Bilde Sorensen J B ^a   Singh, B N ^a  

^a TECHNICAL UNIVERSITY OF DENMARK   (Denmark)

Author keywords

Bubble Size and Density; Copper; Grain Boundary Character; Grain Boundary Diffusion; Helium Implantation; Sink Efficiency

Indexed keywords

BUBBLE FORMATION; COPPER; CRYSTAL MICROSTRUCTURE; DIFFUSION IN SOLIDS; HELIUM; ION IMPLANTATION; TRANSMISSION ELECTRON MICROSCOPY;

BUBBLE DENSITY; BUBBLE SIZE; DENUDED ZONES; GRAIN BOUNDARY CHARACTER; GRAIN BOUNDARY DIFFUSION; GRAIN BOUNDARY STRUCTURE; HELIUM IMPLANTATION; HELIUM IMPLANTED COPPER; SINK EFFICIENCY;

GRAIN BOUNDARIES;

EID: 0029707344     PISSN: 02555476     EISSN: 16629752     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/msf.207-209.445     Document Type: Article

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