Effects of hot implantation of helium in copper on bubble formation within grains and on grain boundaries

ASTM Special Technical Publication

Volumn , Issue 1175, 1994, Pages 1061-1073

  Singh, Bachu N ^a   Eldrup, Morten ^a   Moslang, Anthony ^a  

^a TECHNICAL UNIVERSITY OF DENMARK   (Denmark)

Author keywords

[No Author keywords available]

Indexed keywords

DIFFUSION; GRAIN BOUNDARIES; MICROSTRUCTURE; TRANSMISSION ELECTRON MICROSCOPY;

BUBBLE NUCLEATION; GRAIN INTERIORS; HELIUM FLUX; HOT IMPLANTATION;

COPPER;

EID: 0028274426     PISSN: 00660558     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (16)