Annealing effects on the microstructure and mechanical properties of LIGA nickel for mems

Materials Research Society Symposium - Proceedings

Volumn 657, Issue , 2001, Pages EE5231-EE5236

  Cho, H S ^a   Babcock, W G ^a   Last, H ^a   Hemker, K J ^a  

^a JOHNS HOPKINS UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; ELASTIC MODULI; HARDNESS; MICROELECTROMECHANICAL DEVICES; NICKEL; TENSILE TESTING; YIELD STRESS;

MICROSTRUCTURAL STABILITY;

MICROSTRUCTURE;

EID: 17144460188     PISSN: 02729172     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (14)