Advanced electrothermal Spice modelling of large power IGBTs

IEE Proceedings: Circuits, Devices and Systems

Volumn 151, Issue 3, 2004, Pages 249-253

  Azar, R ^a   Udrea, F ^a   Ng, W T ^b   Dawson, F ^b   Findlay, W ^c   Waind, P ^c   Amaratunga, G ^a  

^a UNIVERSITY OF CAMBRIDGE   (United Kingdom)

^b UNIVERSITY OF TORONTO   (Canada)

^c DYNEX SEMICONDUCTOR LTD   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; FINITE ELEMENT METHOD; LAPLACE TRANSFORMS; SEMICONDUCTOR DEVICE MODELS; TEMPERATURE; THERMOANALYSIS;

SELF HEATING; THERMAL CIRCUIT;

INSULATED GATE BIPOLAR TRANSISTORS;

EID: 3042565369     PISSN: 13502409     EISSN: None     Source Type: Journal    
DOI: 10.1049/ip-cds:20040448     Document Type: Article

References (13)

1. Ammous, A., Ammous, K., Morel, H., Allard, B., Bergogne, D., Sellami, F., and Chante, J.P.: 'Electrothermal modelling of IGBT's: application to short circuit conditions', IEEE Trans. Power Electron., 2000, 15, (4)
2. Kraus, R., Hoffmann, K., and Türkes, P.: 'Analysis and modelling of the technology dependent electro-thermal IGBT characteristics'. Int. Power Electronics Conf., Yokohama, 1995, pp. 1128-1133
3. Azar, R., Udrea, F., De Silva, M., Amaratunga, G., Ng, W.T., Dawson, F., Findlay, W., and Waind, P.: 'Advanced SPICE modelling of large power IGBT modules'. 37th International Application (IAS) Annual Meeting, Vol. 4, pp. 2433-2436
4. Ammous, A., Ghedira, S., Allard, B., Morel, H., and Renault, D.: 'Choosing a thermal model for electrothermal simulation of power semiconductor devices', IEEE Trans. Power Electron., 1999, 14, (2)
5. Sigg, J., Turkes, P., and Kraus, R.: 'Parameter extraction methodology and validation for an electro-thermal physics based NPT IGBT model'. Proc. 32nd IEEE Industry Applications Conf., 1997, Vol. 2, pp. 1166-73
6. Carslaw, H.S., and Jaeger, J.C.: 'Conduction of heat in solids' (Oxford University Press, Oxford, 1959, 2nd edn.)
7. Arpaci, V.S.: 'Conduction heat transfer' (Addison-Wesley Publishing Co., Reading, MA, 1966)
8. Yeh, L.T., and Chu, R.C.: 'Thermal management of microelectronic equipment: heat transfer theory, analysis methods and design practices' (ASME Press, New York, 2002)
9. Palmer, P.R., Joyce, J.C., Eng, P.Y., Hudgins, J., Santi, E., and Dougal, R.: 'Circuit simulator models for the diode and IGBT with full temperature dependent features'. Proc. 32nd Annual Power Electronics Specialists Conf., 2001, Vol. 4, pp. 2171-2177
10. Lienhard, J.H. IV, and Lienhard, J.H. V: 'A heat transfer textbook' (Phlogiston Press, version 1.01, 2001, 3rd edn.), p. 718
11. Veiloja, T., and Costa, L.: 'Combined electrical and thermal circuit simulation using APLAC, Part 3: thermal spreading impedance models'. Circuit Theory Laboratory Report Series No. CT-34; Espoo 1998, p. 54
12. Marz, M., and Nance, P.: 'Thermal modelling of power electronic systems'. Infineon Technologies AG, Munich, 1999
13. Hancock, J.M.: 'A hierarchical cross-platform physics based MOSFET model for SPICE AND SABER'. Siemens Microelectronics, 2001