Investigation of the evaluation of mechanical properties of thin films by microbridge testing

Gongneng Cailiao/Journal of Functional Materials

Volumn 36, Issue 11, 2005, Pages

  Zhou, Zhi Min ^a   Zhou, Yong ^a   Ding, Wen ^a   Cao, Ying ^a   Chen, Ji An ^a   Yang, Chun Sheng ^a  

^a Shanghai Jiao Tong University   (China)

Author keywords

Mechanical properties; Microbridge testings; Thin films

Indexed keywords

ELASTIC MODULI; EVALUATION; MECHANICAL PROPERTIES; NICKEL; RESIDUAL STRESSES;

ELASTIC MODULE; MICROBRIDGE TESTINGS;

THIN FILMS;

EID: 30044442842     PISSN: 10019731     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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