Wettability and interfacial reaction between Si3N4 and Cu-based alloys

Key Engineering Materials

Volumn 159-160, Issue , 1999, Pages 287-292

  Nakashima, K ^a   Makino, T ^b   Mori, K ^a   Glaeser, A M ^c  

^a KYUSHU UNIVERSITY   (Japan)

^b KYOCERA CORPORATION   (Japan)

^c University of California Berkeley   (United States)

Author keywords

Cu Based Alloy; Interfacial Reaction; Joining; Si3N4; Wettability

Indexed keywords

EID: 0040910978     PISSN: 10139826     EISSN: 16629795     Source Type: Book Series    
DOI: None     Document Type: Article

References (8)

1. B. J. Dalgleish, A. P. Tomsia, K. Nakashima, M. R. Locatelli and A. M. Glaeser, Scripta Metallurgica et Materialia, 31, [8] (1994), p. 1043.
2. H. Matsumoto, M. R. Locatelli, K. Nakashima, A. M. Glaeser and K. Mori, Materials Transaction, JIM, 36, [4] (1995), p. 555.
3. I. Tuah-Poku, M. Dollar, and T. B. Massalski, Met. Trans. A, 19A, [3], (1988), p. 675.
4. K. Nakashima, H. Matsumoto, M. R. Locatelli, A. M. Glaeser and K. Mori, Proc. of The 2nd Pacific Rim Int. Conf. on Adv. Mater. and Proc., Vol 1 (1995), p. 729.
5. R. E. Loeman and A. P. Tomsia, J. Am. Ceram. Soc. Bull., 67, (1988), p. 375.
6. M. G. Nicholas, T. M. Valentine, and M. J. Waite, J. Mater. Sci , 15, (1980), p. 2197.
7. G. Ceccone, S. D. Peteves, M. G. Nicholas, B. J. Dalgleish, A. P. Tomsia, and A. M. Glaeser, Acta Materialia, 44, [2], (1996), p. 657.
8. M. Nakamura and S. D. Peteves, J. Am. Ceram Soc., 73, [5], (1990),p. 1221.