Etching silicon wafer without hydrofluoric acid

Applied Physics Letters

Volumn 87, Issue 26, 2005, Pages 1-3

  Liu, Hong ^a,b   Wang, Zhong Lin ^b  

^a SHANDONG UNIVERSITY   (China)

^b Georgia Institute of Technology   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ETCHING TECHNIQUES; HYDROTHERMAL-ETCHING TECHNIQUE; SILICON NANOSTRUCTURES; VERTICAL HOLES;

BISMUTH; ELECTRIC POTENTIAL; ETCHING; HYDROFLUORIC ACID; NANOSTRUCTURED MATERIALS; POROUS SILICON;

SILICON WAFERS;

EID: 29744448538     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2158021     Document Type: Article

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