Modeling spatial strain gradient effects in thermo-mechanical fatigue of copper microstructures

International Journal of Fatigue

Volumn 26, Issue 9, 2004, Pages 947-957

  Pucha, Raghuram V ^a   Ramakrishna, Gnyaneshwar ^a   Mahalingam, Saketh ^a   Sitaraman, Suresh K ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Copper; Electronic packaging; Microvia boards; Spatial strain gradients; Thermo mechanical fatigue

Indexed keywords

DEGREES OF FREEDOM (MECHANICS); DIELECTRIC MATERIALS; FINITE ELEMENT METHOD; MICROSTRUCTURE; PLASTIC DEFORMATION; PLASTIC FLOW; PLASTICITY; THERMAL CYCLING; THERMAL EXPANSION; THIN FILMS;

ELECTRONIC PACKAGING; MICROVIA BOARDS; SPATIAL STRAIN GRADIENTS; THERMO-MECHANICAL FATIGUE;

COPPER;

EID: 2942710041     PISSN: 01421123     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijfatigue.2004.01.008     Document Type: Article

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