2-Step algorithm for automatic alignment in wafer dicing process

Microelectronics Reliability

Volumn 44, Issue 7, 2004, Pages 1165-1179

  Kim, Hyong Tae ^a   Song, Chang Seop ^a   Yang, Hae Jeong ^b  

^a Hanyang University   (South Korea)

^b Korea Polytechnic University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ALGORITHMS; DATA REDUCTION; ERROR ANALYSIS; KINEMATICS; MICROELECTRONICS; SEMICONDUCTOR DEVICE MANUFACTURE;

ALIGNMENT ERRORS; AUTOMATIC ALIGNMENT; CONTACT POINTS; WAFER DICING;

WSI CIRCUITS;

EID: 2942700008     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2004.01.005     Document Type: Conference Paper

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