Chemical and structural characterization of silane adhesion promoting films for use in microelectronic packaging

Materials Research Society Symposium - Proceedings

Volumn 629, Issue , 2000, Pages

  Jenkins, M ^a   Snodgrass, J ^a   Dauskardt, R H ^a   Bravman, J C ^a  

^a Stanford University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ATOMIC FORCE MICROSCOPY; CHEMICAL BONDS; ELECTRONICS PACKAGING; INTERFACES (MATERIALS); MONOLAYERS; MORPHOLOGY; SILANES; SILICON WAFERS; STRUCTURE (COMPOSITION); SUBSTRATES; X RAY PHOTOELECTRON SPECTROSCOPY;

ADHESION PROMOTER; AMINOSILANE; ANGLE-RESOLVED X RAY PHOTOELECTRON SPECTROSCOPY; ATOMIC BONDING; BENZOCYCLOBUTENE; MICROELECTRONIC PACKAGING; OXIDIZED SILICON WAFER; SURFACE BOND DENSITY;

THIN FILMS;

EID: 0034445371     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)